SPUTTERING TARGET

99.9%, 99.95%, 99.99% High Purity Chromium Sputtering Target


Specifications

High Purity 99.95% High Purity Chromium Sputtering Target

High-Purity sputtering targets made from electrolytic refined chromium are used by PVD Coating and TFT/LCD Industry .

Sunrise Metal is on the top positions of global markets of high purity chromium sputtering targets, molybdenum and tungsten product


Product Description


Item NameHigh purity Chromium sputtering target 99.95% Cr target 99.95%
Purity99.7%,99.95%,99.98%
ShapeSquare /round, according to your request
Available size

Round: dia 25~250m

mRectangular: length up to 1500mm

Customization is available

Oxygen contentlower than 50ppm
CertificatesISO9001:2008, SGS, the third test report
TechnicsPowder Metallurgy
Application

widely used in coating processing industries

a: architectural glass, car using glass, graphic display field.

b:electronic and semiconductor field.

c:decoration and mould field.  

d:optics coating materials  

Advantage

High Hard texture

Low impurity content

Better heat dissipation

High Tensile strength 

Quality Standard (99.95% Cr)
ElementValue(≤ppm)ElementValue(≤ppm)
Fe5Al2
Cu2P2
Pb3Si4
C4S15
O42
N1

Molybdenum Target


Specifications

(1).Brand Name:SYMT 

(2).Material:molybdenum 

(3).Application:industry,for laser machine 

(4).Purity:99.95


1. Molybdenum target

Dia.(10-500mm) x thickness(0.1-100)mm

Density:10.2g/cm3     Purity:99.95%.99.97%    meterial:Mo1,TZM,Mo-La

Surface: black,C.C,bright,polished       Standard: ASTMB 386


2. Physical and chemical properties


Product NameMolybdenum disc
Tensile strength610 Mpa
Elongation≥10%
Material CompositionMo1,TZM,Mo-La
Purity≥99.95%
Use temperature1800℃
Highest temperature2200℃
Quantitative analysis
ElementNiMgFePbAlBiSiCaPCu
Concentration(%)0.00060.00060.0010.00060.0030.00060.0030.00060.0010.0006
ElementCOSb






Concentration(%)0.0010.0050.0006






Purity(Metallic Base) Mo≥99.95%
Quantitative analysis
ElementSiMnNiCuVZrOPFeMg
Concentration(%)0.0020.00090.00080.00180.0130.0860.320.0010.00110.0015
ElementAlTiCaC N




Concentration(%)0.0010.5<0.0010.0120.0022




Purity(Metallic Base) Mo≥99.06%(TZM)
ElementNiMgFePbAlBiSiCdP
Concentration(%)0.0014<0.00010.0047<0.00010.0002<0.0001<0.001<0.001<0.001
ElementCNSbSnCu



Concentration(%)0.00210.03<0.0001<0.0001<0.0005



Purity(Metallic Base) Mo≥99.97
3. Application:
Mainly used for high-temperature furnace components, crucibles, missiles and other rocket nozzle under high temperature.
 
Molybdenum discs are widely used as contact materials in silicon controlled rectifiers diodes, transistors and thyristors (GTO’S). Other than in specialist applications, molybdenum is now accepted as the first choice mounting material for power semiconductor devices due to its significantly lower cost and weight.The fact that both materials have a similar coefficient of expansion to silicon combined with high thermal conductivity makes them an ideal choice, especially in large area power devices where considerable heat is generated.

Niobium sputtering targets, Niobium disc 


Material: RO4200-1, RO4210-2

Size:

circular targets:  Diameter  10mm up to 400mm x Thickness 2mm up to 28mm

rectangular targets: Thickness 1mm up to 20.32mm x Width up to 800mm x Length up to 3000mm 

Purity:  >=99.9%  or  99.95%

Table 1: technology  parameter


Recrystallization95%min
Grain sizeASTM 4 or finer
Surface finish16Rms max. or Ra 0.4 ( RMS64 or better)
Flatness0.1mm or 0.15% max
Tolerance+/-0.010" on all dimensions

Tantalum target, Tantalum sputtering targets, Tantalum- tungsten Alloy targets


Material:RO5200, RO5400, RO5252(Ta-2.5W), RO5255(Ta-10W)

Size: circular targets:Diameter  15mm up to 400mm x Thickness 3mm up to 28mm

rectangular targets:Thickness 1mm up to 40mm x Width up to 1000mm x Length up to 3000mm


1: technology  parameter



Grade3N, 3N5, 4N, with Ta 99.99%min
Recrystallization95%min
Grain sizeASTM 4 or finer
Surface finish16Rms max. or Ra 0.4 ( RMS64 or better)
Flatness0.1mm or 0.15% max
Tolerance +/-0.010" on all dimensions

Titanium-Aluminum alloy target 


Specifications


Titanium-Aluminum alloy target 

1.alloy sputtering target 

2.maximum diameter:320mm 

3.maximum length:1200mm


Titanium-Aluminum alloy target (Ti-Al alloy target):

1. Processing technology: vacuum smelting

2. Alloy uniform gold degree:  high

3. The density: high

4. Proportion(wt%): such as 99:1, 64:36, 70:30, 90:1~10 (Ti:Al)

5. Purity: 99.7-99.9%

6. Dimensions:  (Various kinds of forms of alloy target materials)

(1). maximum diameter:320mm

(2). maximum length:1200mm

7. Usages: High purity alloys has been widely applied in the decoration profession, aerospace, anti-corrosion layer, antifriction tool membrane, integrated circuit, display, solar battery, optical components, magnetic storage, etc.

    Size and quality is according to customer’s request.




Titanium target

Purity:99.9%-99.999%

Demension:1.5-20*<200*L mm;Φ80-100*L mm




Tungsten targets

Specifications

1.Purity:99.95%min 

2.Density:19.2g/cm3 

3.Certification:ISO9001-2008 

4.Surface:Polished or as your needs 

5.Delivery:7-15 days 


Tungsten targets

 

1 Name: Tungsten targets

2 Appearance: Silver white metal luster

3 Purity: Mo≥99.95%

4 Density: not less than 19.1g/cm3

5 Supply state: Surface polishing, CNC machine processing

6 Quality standards: GB/T 3875-2006 (tungsten plate)

7 Specifications:

Unit:mm






ThicknessWidthLengthParallelismVerticalitySurface finish
Tungsten target8.0~16.010~45010~500≤0.05≤2o≤Ra0.8
3.0~8.010~45010~800≤0.05≤2o≤Ra0.8
1.0~3.010~45010~1200≤0.05≤2o≤Ra0.8
Special sizes can be manufactured based on customers' requirements
8 Production process:
Materials--CIP--IF induction sintering --hot rolling—annealing--cold rolling --annealing--cutting--machining--tungsten targets
9  Production equipments:
Cool isostatic pressing machine(CIP), IF induction sintering furnace ,four-high cold mill, vacuum annealing furnace , W43G series straightener , hydraulic plate shears , water jet, wire cutting machine, CNC vertical turning machine ,machining center , CNC milling machine ,flat-stone mill
10 Applications:
Tungsten target is mainly used in plasma sputtering industry.With the electric field, electron collided with the argon atom when fly to the substrate, then argon atoms and electrics were ionized .The electrics fly to the substrate while argon atoms accelerate to bomb the target, the neutral atoms (or molecules) in the target deposit on the substrate and become the coating.
Since the tungsten resistant to high temperature and corrosion, tungsten targets are widely used in petroleum chemical industry, aviation, machine manufacturing, and electronics semiconductor industries and so on.
SYMT can provide tungsten targets that made with tungsten powder which purity is 99.95%. High quality products have been made after decades of procedures such as pressing, sintering, rolling, cutting and surface grinding. Super sputtering target (single heavy reach to 100kg) is available at present.
If you need more information, please contact us.

Zirconium targets

R60702

High purity Zrirconium (Zr+Hf>99.95%,Hf<300ppm or Hf<4.5%)

Size: plate target

Thickness:0.04 to 1.40”( 1.0 to 35mm)

Width:2 to 20”( 50 to 500mm)

Length:3.9” to 6.56 feet(100-200mm)


Cylindric targets:

3.94  Dia*1.58”(65 Dia*40mm)

2.56 ia*158” (65Dia*40mm)

Or other sizes as requested


Tube targets

2.76 D*0.28WT*39.4”L(70 D*7 WT *1000mm L)

3.46 OD*0.39 WT*48.4”L(88OD *10  WT*1230mm)

Or other sizes as requested!